Features:

Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics
Easily removes solder from components or pads on a circuit board
Concentrated fine copper braiding utilizes less length of wick for each desoldering application
Made of clean, oxide-free copper wire
Tight weave enables quick “on and off” desoldering
Formulated with a flux designed for higher activation temperatures
To be used in conjunction with processes using RMA type no-clean fluxes
5’ and 10’ lengths available on static dissipative bobbins in compliance with ESD Association Standard
Leaves a residue that is environmentally safe
Uses flux classification type L0 per IPC J-STD-004B

Wire Specifications:

Wire Type	Width	Configuration
A Wire	0.025” (±0.003”) .635mm (±0.08mm)	2 strands of 42awg X 16 (total 32 strands), 31 PPI
B Wire	0.050” (±0.004”) 1.27mm (±0.10mm)	4 strands of 42awg X 16 (total 64 strands), 12.5 PPI
C Wire	0.075” (±0.005”) 1.90mm (±0.13mm)	6 strands of 42awg X 16 (total 96 strands), 16 PPI
D Wire	0.095” (±0.007”) 2.41mm (±0.18mm)	5 strands of 42awg X 24 (120 total strands), 19 PPI
E Wire	0.117” (±0.008”) 2.97mm (±0.20mm)	5 strands of 40awg X 24 (120 total strands), 16 PPI

I081B