EasyBraid OS-C-100 One Step™ No-Clean Desoldering Braid – 0.075" x 100'

The EasyBraid OS-C-100 One Step™ Desoldering Braid is a premium no-clean solder wick engineered for fast, efficient solder removal during electronics rework, repair, and PCB assembly. Constructed from tightly woven, oxide-free copper, it rapidly absorbs molten solder while minimizing heat exposure to sensitive components and circuit boards.

Pre-fluxed with Rosin Mildly Activated (RMA) no-clean flux, the OS-C-100 leaves minimal residue, eliminating the need for post-cleaning in many applications. Its 0.075" (1.91 mm) width is well suited for larger solder joints, wider pads, and through-hole components, while the 100-foot spool provides excellent value for production environments, repair facilities, and high-volume electronics work.

Features & Benefits

• Premium One Step™ no-clean desoldering braid
• Tightly woven oxide-free copper provides fast, efficient solder removal
• RMA no-clean flux minimizes residue and often eliminates the need for board cleaning
• Ideal for PCB repair, rework, prototyping, and electronics manufacturing
• Tight weave enables quick "on and off" desoldering while reducing thermal stress on components
• Compatible with R, RA, RMA, and no-clean flux processes
• Green color coding for easy size identification
• Long 100 ft (30.5 m) spool minimizes spool changes during high-volume production
• Available on static-dissipative bobbins upon request for ESD-sensitive applications.

Specifications

• Manufacturer: EasyBraid
• Model: OS-C-100
• Series: One Step™ OS
• Product Type: No-Clean Desoldering Braid
• Braid Width: 0.075" (1.91 mm)
• Length: 100 ft (30.5 m)
• Material: Oxide-Free Copper
• Flux Type: Rosin Mildly Activated (RMA), No-Clean
• Flux Classification: IPC J-STD-004B Type L0
• Color: Green
• Applications: PCB rework, solder removal, electronics repair, assembly, and prototyping.